The board
- Hours
- Full time
- Where
- Santa Clara, CA
- Posted
- Sep 8
Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.
At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.
Your Team, Your Impact
In this role, you will support Marvell's AI Products team and gain hands-on exposure to the assembly and packaging technologies — including 2.5D/3D chip-on-wafer development and co-packaged optics — that bring AI silicon from concept to high-volume manufacturing.
What you'd do
- Support process development activities for 2.5D/3D chip-on-wafer assembly and co-packaged optics in collaboration with foundry and OSAT partners
- Track and analyze data related to packaging builds to help identify trends and potential risks during NPI phase
- Document risks and mitigation plans as products mature toward high-volume manufacturing readiness
- Participate in partner and internal team meetings to gain exposure to design-for-manufacturing, process development, reliability and cost-tradeoff discussions
What they want
- Currently enrolled in a Master's Degree in Materials Science, Chemical Engineering, Mechanical Engineering, Chemistry, Physics, or a related field with an expected graduation date of Fall 2027 – Summer 2028
- Coursework or academic project experience related to semiconductor processing, materials science, or packaging/assembly technologies
- Familiarity with data analysis and organization using tools such as Excel, JMP, or Minitab
- Strong written and verbal communication skills, with the ability to summarize technical information clearly for cross-functional audiences
- Demonstrated ability to work independently and manage multiple tasks in a fast-paced environment
- Exposure to advanced packaging concepts such as 2.5D/3D chip-on-wafer assembly or co-packaged optics through coursework, research, or internship experience
- Familiarity with programming or scripting languages such as Python for data analysis
- Prior internship or research experience in a semiconductor, manufacturing, or process engineering setting
- Basic understanding of reliability testing or failure analysis concepts
- Starts
- 2026-09-08